Rockwell-automation T8471 Trusted TMR 120V dc Digital Output Module - Manual de usuario Pagina 4

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Trusted
TM
Module T8471
Issue 14 Apr 10 PD-T8471 4
Table of Contents
1. Description...................................................................................................................................8
1.1. Field Termination Unit (FTU) .......................................................................................................9
1.2. Front Panel Unit (FPU) ................................................................................................................9
1.3. Host Interface Unit (HIU) ...........................................................................................................10
1.4. Field Interface Unit (FIU) ...........................................................................................................10
1.5. Line monitoring and output states..............................................................................................11
1.6. Housekeeping............................................................................................................................11
1.7. Fault Detection/Testing ..............................................................................................................11
1.8. Sequence of Events Characteristics..........................................................................................12
1.9. Output Switch Structure .............................................................................................................12
1.9.1. Switch Diagnostics.....................................................................................................................13
1.9.2. Short Circuit Protection Issues ..................................................................................................14
1.9.3. Group Fail Safe Switches ..........................................................................................................14
2. Installation..................................................................................................................................15
2.1. Module Insertion/Removal .........................................................................................................15
2.2. Cable Selection..........................................................................................................................15
2.3. Termination................................................................................................................................15
2.4. Module Pinout Connections .......................................................................................................16
2.5. Trusted
TM
Module Polarisation/Keying.......................................................................................17
3. Application .................................................................................................................................18
3.1. Module Configuration.................................................................................................................18
3.2. T8471 Complex Equipment Definition .......................................................................................18
3.2.1. Rack 1: DO ................................................................................................................................19
3.2.2. Rack 2: STATE ..........................................................................................................................19
3.2.3. Rack 3: AI ..................................................................................................................................20
3.2.4. Rack 4: CI ..................................................................................................................................21
3.2.5. Rack 5: LINE_FLT .....................................................................................................................21
3.2.6. Rack 6: DISCREP......................................................................................................................21
3.2.7. Rack 7: Housekeeping...............................................................................................................22
3.2.8. Rack 8: INFO .............................................................................................................................23
3.3. Sequence of Events Configuration ............................................................................................24
3.4. SYSTEM.INI File Configuration .................................................................................................24
4. Operation ...................................................................................................................................25
4.1. Front Panel ................................................................................................................................25
4.2. Module Status LEDs ..................................................................................................................26
4.3. I/O Status LEDs .........................................................................................................................27
5. Fault Finding and Maintenance..................................................................................................28
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