Rockwell-automation T8110B/T8110 Trusted TMR Processor Manual de usuario Pagina 4

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Trusted
TM
TMR Processor T8110B/T8110
Issue 18 Feb 08 PD-T8110B/T8110 4
Table of Contents
1. Description...................................................................................................................................8
1.1. Overview ......................................................................................................................................8
1.2. Hardware Implemented Fault Tolerant (HIFT) Clock...................................................................9
1.3. Power Distribution........................................................................................................................9
2. Installation..................................................................................................................................10
2.1. Module Insertion/Removal .........................................................................................................10
2.2. PCBs and Connectors ...............................................................................................................10
2.3. Module Pinout Connections.......................................................................................................11
2.3.1. External I/O Connector (PL1) ....................................................................................................11
3. Application .................................................................................................................................12
3.1. Module Configuration.................................................................................................................12
3.1.1. Updater Section .........................................................................................................................12
3.1.2. Security Section .........................................................................................................................12
3.1.3. ICS2000 Section........................................................................................................................12
3.1.4. System Section ..........................................................................................................................12
3.1.5. ISaGraf Configuration section....................................................................................................16
3.1.6. Chassis Section .........................................................................................................................16
3.1.7. InterRange Instrumentation Group. (IRIG) ................................................................................16
3.1.8. Additional User Serial Ports.......................................................................................................17
3.2. Complex I/O Equipment Definition.............................................................................................18
I/O Complex Equipment ‘...........................................................................................................18
3.2.1. TTMRP’......................................................................................................................................18
3.3. Inter-Module Bus........................................................................................................................21
3.3.1. Processor Memory Voting Bus ..................................................................................................21
3.3.2. Inter-Module Bus Voting Bus .....................................................................................................21
3.3.3. Processor Voting Bus ................................................................................................................21
3.3.4. Front Panel Voting Bus..............................................................................................................22
3.4. Isolation......................................................................................................................................22
4. Operation ...................................................................................................................................23
4.1.1. System Overheads ....................................................................................................................24
4.1.2. On-Line Operator Inputs ............................................................................................................24
4.2. Standby Processor.....................................................................................................................24
4.3. Module Management .................................................................................................................24
4.4. Security ......................................................................................................................................24
4.5. Front Panel ................................................................................................................................25
4.6. Module Status LEDS..................................................................................................................26
4.6.1. Reset Button ..............................................................................................................................27
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