
Trusted
TM
TMR Module T8160
Issue 13 May 13 PD-T8160 4
Table of Contents
1. Description ................................................................................................................................... 9
2. Installation .................................................................................................................................. 10
2.1. Module Insertion/Removal ......................................................................................................... 10
2.2. PCBs and Connectors ............................................................................................................... 10
2.3. Module Pinout Connections ....................................................................................................... 11
2.3.1. I/O Connector (PL 1) .................................................................................................................. 11
2.4. Trusted
TM
Module Polarisation/Keying. ...................................................................................... 12
3. Application ................................................................................................................................. 13
3.1. Module Management ................................................................................................................. 13
3.2. Communication Busses ............................................................................................................. 13
3.2.1. Inter-Module Bus ........................................................................................................................ 13
3.2.2. Processor Memory Voting Bus .................................................................................................. 13
3.2.3. Processor Control Voting Bus .................................................................................................... 13
3.3. Isolation ...................................................................................................................................... 14
3.4. I/O Modules Supported .............................................................................................................. 14
4. Configuration .............................................................................................................................. 15
4.1. I/O Complex Equipment ‘TTMRI’ ............................................................................................... 16
4.2. I/O Complex Equipment ‘TTMRI_II’ ........................................................................................... 18
4.3. I/O Complex Equipment ‘SX7401’ ............................................................................................. 20
4.4. I/O Complex Equipment ‘TX7401’ ............................................................................................. 21
4.5. I/O Complex Equipment ‘TX7401_P’ ......................................................................................... 22
4.6. I/O Complex Equipment ‘SX7402’ ............................................................................................. 23
4.7. I/O Complex Equipment ‘TX7402’ ............................................................................................. 24
4.8. I/O Complex Equipment ‘SX7404’ ............................................................................................. 25
4.9. I/O Complex Equipment ‘TX7404’ ............................................................................................. 26
4.10. I/O Complex Equipment ‘DX7411F’ ........................................................................................... 27
4.11. I/O Complex Equipment ‘SX7411’ ............................................................................................. 29
4.12. I/O Complex Equipment ‘SX7411F’ ........................................................................................... 31
4.13. I/O Complex Equipment ‘SX7418F’ ........................................................................................... 33
4.14. I/O Complex Equipment ‘F7419’ ................................................................................................ 35
4.15. I/O Complex Equipment ‘SX7420A’ ........................................................................................... 37
4.16. I/O Complex Equipment ‘SX7420D’ ........................................................................................... 38
4.17. I/O Complex Equipment ‘S7420_PP’ ......................................................................................... 39
4.18. I/O Complex Equipment ‘SX7431’ ............................................................................................. 40
4.19. I/O Complex Equipment ‘SX7431A’ ........................................................................................... 41
4.20. I/O Complex Equipment ‘SX7431AP and SX7431PP’ ............................................................... 42
4.21. I/O Complex Equipment ‘DX7441A’ ........................................................................................... 43
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